Mobile Main Board PCB with Eight Layers

Model No: IBE-PCB31 Technic parameters of eight-layer HDI mobile PCB: Materials: FR-4 and RCC Thickness: 1.0mm Surface processing: immersion

Mobile Main Board PCB with Eight Layers

Detailed Product Description

Technic parameters of eight-layer HDI mobile PCB: Materials: FR-4 and RCC Thickness: 1.0mm Surface processing: immersion gold Laser drill hole (minimum): 0.1mm Buried and blind via structure: L1-L2, L2-L7 and L8-L7 Line width/space (minimum): 0.1/0.1mm AOI inspection RoHS compliant

Model No.:	IBE-PCB31
Product Origin:	China